Recent Feature Headlines


February 2012

Autoliv Prepares for Rollout of New Automotive Night Vision System

Teledyne Dalsa Prepares for Microbolometer Fabrication

N2 Imaging Expanding and Moving up on the Infrared Food chain

Boeing Evaluating Multi-Sensor Fusion for Force Protection

JPL Extends T2SL Barrier Detector Response to Full MWIR Band

New Infrared Imaging Products

Company Briefs

Government Contract Awards

Government Contract Solicitations


January 2012

Military Infrared Markets Start to Slow Down in Anticipation of Budget Cuts

Spectrolab Moves InGaAs APDs into Production

Raytheon Takes Next Step in Microbolometer Wafer-Level-Packaging

Thales and Safran Form Joint Venture in Optronics

Advanced Common Sensor Program Holds Out Hope for 3rd Gen

L-3 Acquiring Kollmorgen

Axsys Renamed to General Dynamics GIT

New Infrared Imaging Products

Company Briefs

Government Contract Awards

Government Contract Solicitations


December 2011

Whither 3rd Gen FLIR?

Qmagiq Develops 1K x 1K LWIR Superlattice FPA

NFPA Fire Standard to Undergo Revision

Obzerv Working Full-Out to Install Large Number of Range-Gated Systems

Bridge Semiconductor Partnering with Optex to Roll Out Uncooled TFFE FPA

Gorgon Stare Being Upgraded

New Infrared Imaging Products

Company Briefs

Government Contract Awards

Government Contract Solicitations


November 2011

First Commercial Large Format HOT T2SL FPA Makes its Debut

Ulis Hedges Microbolometer Packaging with Wafer-Level Approach

Irvine Sensors Selling Thermal Imaging Business to Vectronix

Development of InGaAs FPAs Speeds Up in France

Selex Galileo Pushes HOT FPAs to New Level

New Infrared Imaging Products

Company Briefs

Government Contract Awards

Government Contract Solicitations